triplestone

triplestone pushed to master at triplestone/text-to-cad

2026-10-07 09:36:34 +08:00

6d3605c48d refactor: 删除与按钮校验件重复的 front_button_coupon 试片

triplestone pushed to master at triplestone/text-to-cad

2026-10-07 09:28:43 +08:00

4ba100ed4f feat: 开机键改为 Ø14.5 圆形凹面键帽并刻电源图标，微动参数改为可回写实测值，新增按钮校验件

triplestone pushed to master at triplestone/text-to-cad

2026-10-07 09:09:01 +08:00

b1017a7949 test: 底盖完整性断言扣除设计内的 IO 插头让位减料

5bc6eedf3c docs: 清理单开机键缩减后残留的 IO 簇试片与 POWER_MODULE 引用，文档引用测试支持注册件 ID

47ecab254b fix: IO 开孔合并过窄隔条并新增 Z 向比例校准，试片改为板面 45° 切角并注明偏移实物方向，插头让位移入骨架几何源

7498b0f275 feat: 后板主板 IO 改为打印式逐孔开孔替代原装挡片，新增 IO 开孔校准试片与下段插头让位

fedb28757b fix: 电源后脸螺丝孔改为风扇朝左板装机姿态的实物验证孔位，插座示意移至后脸底部中间

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triplestone pushed to master at triplestone/text-to-cad

2026-10-06 12:34:07 +08:00

7db5d7ec3e test(modular-case): 更新几何指纹基准以匹配单开机键缩减(45 项重写)

cf7354db5f feat(modular-case): 前面板IO区缩减为单开机键——裸微动开关仓+U形压板+打印按钮三件套

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triplestone pushed to master at triplestone/text-to-cad

2026-10-06 09:39:26 +08:00

2354817300 docs: 修正盖板快速/详细模式描述并补充后板定位薄片的 PCIe 嵌板孔

730daccc96 test: 新增 modular-case 几何指纹回归测试与基准，可用 --update 重写

ef849b7128 feat: 铜柱攻丝试片加档位凸点与摆向切角，新增全部校准件打印就绪回归测试

8aa2a8300a refactor: 清理 modular-case 未使用的导入与变量

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triplestone pushed to master at triplestone/text-to-cad

2026-10-06 08:52:40 +08:00

49d9564a32 fix: 主板铜柱安装恢复为中板成形攻丝孔并新增三档攻丝底孔校准件

fa82ac4fbb feat: 新增后板定位薄片校准件并支持按名导出单个试片

e172c6b656 feat: 后板 PCIe 区改为可替换嵌板接口，录入无线网卡尺寸并加内侧盲攻丝固定孔与嵌板包络

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triplestone pushed to master at triplestone/text-to-cad

2026-10-05 22:25:59 +08:00

b5ca447a82 fix(modular-case): 回写风扇开孔实测标定(Y+1.4/Z-2.5)，增补右板镂空试片并将打印导出统一为单STL格式

triplestone pushed to master at triplestone/text-to-cad

2026-10-05 06:57:18 +08:00

5bfffaf76b fix: 同步 modular-case 实物嵌件与铜柱安装配置

triplestone pushed to master at triplestone/text-to-cad

2026-10-04 15:57:51 +08:00

ae9c6ca16b docs: 修正 modular-case 风扇与 PCIe 定位说明

256f71c089 test: 补齐 modular-case 铜柱逐孔接合校验

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triplestone pushed to master at triplestone/text-to-cad

2026-10-04 09:59:42 +08:00

d0cd33911a fix: 修正 modular-case 主板安装孔方向

triplestone pushed to master at triplestone/text-to-cad

2026-10-03 12:42:02 +08:00

119aaebcab refactor: 移除骨架上段搭接舌片的 4 个 Ø8 攻丝凸台，搭接螺丝直接攻入 2 mm 舌片

triplestone pushed to master at triplestone/text-to-cad

2026-10-03 08:12:01 +08:00

9f41b6148d refactor: modular-case 设计数据集中到 config.py 并按世界轴重命名

triplestone pushed to master at triplestone/text-to-cad

2026-10-03 01:05:38 +08:00

9dac8bd455 fix: 水平打印的磁铁座窝改为 45° 泪滴形，避免孔顶悬空塌陷

2d46f74bb2 fix: 主板铜柱孔位统一以已验证的校准模板为唯一数据源，修正骨架孔位偏差 0.4~1.3 mm

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triplestone pushed to master at triplestone/text-to-cad

2026-10-02 11:20:17 +08:00

1c2a662102 feat: 骨架搭接加对位键，顶板增主板仓后部出风槽并改用自绘模板字

23d1dbb363 feat: 立面板与盖板加定位凸耳，前面板上下件改为 45° 斜接

285b0635aa refactor: 清理机箱外壳死代码与未用接口，修正 PCIe 净空等过期注释

882537a39b fix: 蜂窝前上板装甲框改为内凹刻线以整面贴床，悬空检查放行可搭桥窄带

32d9646a65 fix: 机箱总高加 2 mm，主板与上下盖板各留 1 mm 装配间隙

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triplestone pushed to main at triplestone/docker

2026-09-22 10:52:55 +08:00

4b6b34f3ae docs: 调整代理配置文件统一维护路径说明

triplestone pushed to main at triplestone/docker

2026-09-21 20:58:50 +08:00

277b6fa94c feat(dev): 增加 dm8/minio/redis 编排配置与虚拟机文档

8747e9bd85 feat(agent): 规范化 Agent 标准设计体系并配置音乐标签服务

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triplestone pushed to main at triplestone/comment-review

2026-09-17 07:16:53 +08:00

45a9f1710c feat(patterns): 检出括号哈希溯源、与历史一致对比与悬空决策标签

triplestone pushed to main at triplestone/comment-review

2026-09-15 20:26:35 +08:00

9907b5980e fix(bin): 标记 bin/cmr.js 为可执行

triplestone pushed tag v1.0.0 to triplestone/comment-review

2026-09-15 20:19:08 +08:00

triplestone created branch main in triplestone/comment-review

2026-09-15 20:19:08 +08:00